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Results:
1-7
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Results: 7
Authors:
ZAKEL E
VILLAIN J
REICHL H
Citation: E. Zakel et al., RELIABILITY AND AU-CONCENTRATION IN OLB SOLDER FILLETS OF TAB-DEVICESHAVING A 75 MU-M PITCH, IEEE transactions on components, packaging, and manufacturing technology. Part B, Advanced packaging, 19(1), 1996, pp. 138-147
Authors:
KLOESER J
ZAKEL E
BECHTOLD F
REICHL H
Citation: J. Kloeser et al., RELIABILITY INVESTIGATIONS OF FLUXLESS FLIP-CHIP INTERCONNECTIONS ON GREEN TAPE CERAMIC SUBSTRATES, IEEE transactions on components, packaging, and manufacturing technology. Part A, 19(1), 1996, pp. 24-33
Authors:
WEISS S
ZAKEL E
REICHL H
Citation: S. Weiss et al., MOUNTING OF HIGH-POWER LASER-DIODES ON DIAMOND HEATSINKS, IEEE transactions on components, packaging, and manufacturing technology. Part A, 19(1), 1996, pp. 46-53
Authors:
ZAKEL E
Citation: E. Zakel, INTERNATIONAL TAPE AUTOMATED BONDING SYMPOSIUM (ITAB) - FOREWORD, IEEE transactions on components, packaging, and manufacturing technology. Part B, Advanced packaging, 17(4), 1994, pp. 525-526
Authors:
ZAKEL E
AZDASHT G
KRUPPA P
REICHL H
Citation: E. Zakel et al., RELIABILITY INVESTIGATIONS OF DIFFERENT TAPE METALLIZATIONS FOR TAB-OUTER LEAD BONDING, IEEE transactions on components, packaging, and manufacturing technology. Part B, Advanced packaging, 17(4), 1994, pp. 537-546
Authors:
ZAKEL E
AZDASHT G
REICHL H
Citation: E. Zakel et al., DEGRADATION OF TAB OUTER LEAD CONTACTS DUE TO THE AU-CONCENTRATION INEUTECTIC TIN-LEAD SOLDER, IEEE transactions on components, packaging, and manufacturing technology. Part B, Advanced packaging, 17(4), 1994, pp. 569-577
Authors:
ZAKEL E
REICHL H
Citation: E. Zakel et H. Reichl, AU-SN BONDING METALLURGY OF TAB CONTACTS AND ITS INFLUENCE ON THE KIRKENDALL EFFECT IN THE TERNARY CU-AU-SN, IEEE transactions on components, hybrids, and manufacturing technology, 16(3), 1993, pp. 323-332
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