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Results: 1-5 |
Results: 5

Authors: Kurmaev, EZ Postnikov, AV Palmer, HM Greaves, C Bartkowski, S Tsurkan, V Demeter, M Hartmann, D Neumann, M Zatsepin, DA Galakhov, VR Shamin, SN Trofimova, V
Citation: Ez. Kurmaev et al., Electronic structure of FeCr2S4 and Fe0.5Cu0.5Cr2S4, J PHYS-COND, 12(25), 2000, pp. 5411-5421

Authors: Galakhov, VR Finkelstein, LD Zatsepin, DA Kurmaev, EZ Samokhvalov, AA Naumov, SV Tatarinova, GK Demeter, M Bartkowski, S Neumann, M Moewes, A
Citation: Vr. Galakhov et al., Interaction of Cu 3d and O 2p states in Mg1-xCuxO solid solutions with NaCl structure: X-ray photoelectron and x-ray emission study, PHYS REV B, 62(8), 2000, pp. 4922-4926

Authors: Kurmaev, EZ Zatsepin, DA Winarski, RP Stadler, S Ederer, DL Moewes, A Fedorenko, VV Shamin, SN Galakhov, VR Chang, GS Whang, CN
Citation: Ez. Kurmaev et al., X-ray emission study of ion beam mixed Cu/Al films on polyimide, J VAC SCI A, 17(2), 1999, pp. 593-596

Authors: Zatsepin, DA Galakhov, VR Gizhevskii, BA Kurmaev, EZ Fedorenko, VV Samokhvalov, AA Naumov, SV Berger, R
Citation: Da. Zatsepin et al., Soft-x-ray-emission study of the influence of Li+-doping, irradiation, andplastic deformation on CuO, PHYS REV B, 59(1), 1999, pp. 211-214

Authors: Chang, GS Chae, KH Whang, CN Kurmaev, EZ Zatsepin, DA Winarski, RP Ederer, DL Moewes, A Lee, YP
Citation: Gs. Chang et al., Mechanism for interfacial adhesion strength of an ion beam mixed Cu/polyimide with a thin buffer layer, APPL PHYS L, 74(4), 1999, pp. 522-524
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