N. Vilalta et al., EVOLUTION OF THE MICROSTRUCTURE DURING HIGH-TEMPERATURE CREEP AND OXYGENATION IN DIRECTIONALLY SOLIDIFIED YBA2CU3O7-X, Philosophical magazine. A. Physics of condensed matter. Structure, defects and mechanical properties, 76(4), 1997, pp. 837-855
The microstructure of YBa2Cu3O7-x-Y2BaCuO5 melt-textured composities d
eformed in the secondary and tertiary creep regimes has been investiga
ted by transmission electron microscopy. The high density of Y2BaCuO5
precipitates plays an important role in the microstructural developmen
t as pinning sites for gliding dislocations. In the secondary regime,
trapped dislocations are dissociated, leaving a stacking fault with di
splacement vector [1/2 - delta 0 1/3]. second stacking fault, 1/6 [301
] is typically associated with the former stacking fault. At this stag
e, the deformation microstructure is dominated by diffusive processes
between precipitates interconnected by the trapped dislocations. In th
e tertiary stage, dislocation multiplication is the main factor contro
lling the microstructure. which is characterized by a dramatic increas
e in the density of perfect dislocations with Burgers vectors [100] an
d [110]. Since deformation is performed above the orthohombic-to-tetra
gonal transition temperature, the samples need to be oxygenated in ord
er to achieve the superconducting phase. We have found that this oxyge
nation step, performed at 450 degrees C, induces severe modifications
of the as-deformed microstructure.