Yl. Shen, THERMAL-STRESSES IN MULTILEVEL INTERCONNECTIONS - ALUMINUM LINES AT DIFFERENT LEVELS, Journal of materials research, 12(9), 1997, pp. 2219-2222
Numerical results on the evolution of thermal stresses in multilevel i
nterconnects are presented. Two levels of aluminum lines with an aspec
t ratio of unity, aligned vertically or arranged in a staggered manner
, are considered by recourse to the finite element analysis. The stres
ses are found to be significantly higher in the lower-level lines than
in the upper-level lines, for both the aligned and staggered arrangem
ents. The stress magnitudes are generally smaller in lines of staggere
d arrangement, compared to the case of aligned lines. Implications of
the present findings are discussed, with directions of future studies
highlighted.