A simplified method for planarizing liquid-crystal-on-silicon (LCOS) b
ackplanes is presented. The method relies on the planarizing capabilit
y of spin-cast benzocyclobutene (BCB) polymeric resin. BCB planarizati
on shows a sixfold reduction in step height on the surface of a typica
l LCOS backplane. Contact with the underlying pixel circuitry is made
by dry etching through openings in the BCB layer. Reflective metal (87
% reflectivity) is deposited over the planarized surface and patterned
to form high-aperture-ratio pixel mirrors (84%). An average resistanc
e of 0.75 Ohm per via was achieved with 3.6-mu m-diameter vias in 2-mu
m-thick BCB. The method and the results of this LCOS backplane planar
ization and postprocessing are described. (C) 1997 Optical Society of
America.