TEMPERATURE-GRADIENT TRANSIENT LIQUID-PHASE DIFFUSION BONDING - A NEWMETHOD FOR JOINING ADVANCED MATERIALS

A novel method for transient liquid phase (TLP) diffusion banding of a luminium based materials has been developed which is capable of reliab ly providing excellent bonds with parent material shear strengths. Thi s new method relies on imposing a temperature gradient across the bond line during TLP diffusion banding and this leads to the formation of sinusoidal or cellular interfaces. Consequently, bond strengths are in creased, possibly as a result of the higher metal-metal contact along the non-planar interfaces compared with the planar interfaces associat ed with either conventional TLP or solid state diffusion bonding proce sses. This paper describes the results achieved, implementing the new method and using copper interlayers, when joining Al-Mg-Si, Al-Li allo ys, and an aluminium metal matrix composite with SiC particles. Patent protection has been filed in the UK under UK Patent No. 9709167.2.