PHYSICAL MODELS IN DEVICE SIMULATION OF SI POWER PIN-DIODES FOR OPTIMAL FITTING OF SIMULATION RESULTS TO MEASURED DATA

Citation
M. Isberg et al., PHYSICAL MODELS IN DEVICE SIMULATION OF SI POWER PIN-DIODES FOR OPTIMAL FITTING OF SIMULATION RESULTS TO MEASURED DATA, Compel, 16(3), 1997, pp. 144
Citations number
24
Categorie Soggetti
Mathematical Method, Physical Science","Computer Science Interdisciplinary Applications",Mathematics,"Engineering, Eletrical & Electronic
Journal title
CompelACNP
ISSN journal
03321649
Volume
16
Issue
3
Year of publication
1997
Database
ISI
SICI code
0332-1649(1997)16:3<144:PMIDSO>2.0.ZU;2-F
Abstract
Shows how a sensitivity analysis of different mobility models was carr ied out in order to reach the best fit of simulation results to measur ed data. Simulated data were compared to both electrical (IV-character istics) and optical (excess charge carrier distribution) results. The simulations included both steady state and transient investigations on a temperature scale ranging from room temperature up to 150 degrees C . Concerning lifetimes, a two-trap Shockley-Read-Hall (SRH) recombinat ion model was implemented into the simulation code to be able to model the local lifetime variations of the irradiated samples. At high carr ier concentration, the overall dominating recombination process is the Auger process. From experimental data the Auger coefficients seem to be concentration dependent too, and in addition, proposes a temperatur e dependence to the Auger coefficient.