FABRICATION AND CHARACTERIZATION OF VIAS FOR CONTACTING YBA2CU3O7-X MULTILAYERS

In order to connect multiple layers of high temperature superconductor (HTS) interconnects, low contact resistance vias must be used to main tain high signal propagation speeds and to minimize signal losses. In this work, 40 mu m via contacts through YB2Cu3O7-x/SrTiO3/SiO2/YSZ/YBa 2Cu3O7-x multilayers utilizing dry etching techniques and sputter depo sited Au for contacting through the vias have been successfully fabric ated and characterized. The vias connect two laser ablated YBa2Cu3O7-x (YBCO) signal lines through thick (4-5 mu m) SiO2 insulating layers. This approach to making multilayer superconductor vias provides a low resistance contact between the YBCO layers while maintaining space eff iciency and fabrication compatibility with the superconductor.