HIGH-DENSITY INTERCONNECT AND PACKAGING - HOW TO DESIGN AND IMPLEMENTFOR PRODUCTS

The need for miniaturization of the electronics content of products ca rl be satisfied by high-density interconnection and packaging solution s. The ever-increasing complexity of semiconductor devices has led to the introduction of new styles of package for individual ICs and an in creasing use of unpackaged ICs. Both of these call for finer features and higher intel connection density in the substrates (printed circuit boards, PCBs and multi-chip modules, MCMs) that carry and protect the ICs and passive components. It has become increasingly important to c onsider-the various technological options as early as possible in the design of products. Cost, performance, size and weight comparisons sho uld be made at rile level of the final product rather than of the MCMs , PCBs or sub-assemblies. This paper describes the drivers and benefit s of miniaturization, the technology options for high density intercon nect and packaging, and the factors that should be considered in desig ning. These are illustrated by hardware examples. Finally, some develo pment trends are outlined and conclusions drawn. High density intercon nection and packaging technology overcomes the limiting effects of pre vious technologies and enables the electronics to achieve the high lev els of integration, functionality and miniaturization required for fut ure products.