The need for miniaturization of the electronics content of products ca
rl be satisfied by high-density interconnection and packaging solution
s. The ever-increasing complexity of semiconductor devices has led to
the introduction of new styles of package for individual ICs and an in
creasing use of unpackaged ICs. Both of these call for finer features
and higher intel connection density in the substrates (printed circuit
boards, PCBs and multi-chip modules, MCMs) that carry and protect the
ICs and passive components. It has become increasingly important to c
onsider-the various technological options as early as possible in the
design of products. Cost, performance, size and weight comparisons sho
uld be made at rile level of the final product rather than of the MCMs
, PCBs or sub-assemblies. This paper describes the drivers and benefit
s of miniaturization, the technology options for high density intercon
nect and packaging, and the factors that should be considered in desig
ning. These are illustrated by hardware examples. Finally, some develo
pment trends are outlined and conclusions drawn. High density intercon
nection and packaging technology overcomes the limiting effects of pre
vious technologies and enables the electronics to achieve the high lev
els of integration, functionality and miniaturization required for fut
ure products.