MCM PACKAGING FOR PRESENT-GENERATION AND NEXT-GENERATION HIGH CLOCK-RATE DIGITAL-SIGNAL AND MIXED-SIGNAL ELECTRONIC SYSTEMS - AREAS FOR DEVELOPMENT

This paper will review the manner in which electronic packaging will b e driven by the high-level performance requirements of next-generation mixed-signal systems, and by the evolving characteristics of next-gen eration integrated circuits, Present performance and fabrication limit ations of the multichip module (MCM) technology will be discussed, as well as possible approaches to remove or minimize these constraints, A reas fruitful for research by the simulation community will be noted, This review is intended to provide a broad applications-oriented frame work for the theoretical and simulation-directed papers in this specia l issue on interconnect and packaging.