HYBRID ELECTROMAGNETIC MODELING OF NOISE INTERACTIONS IN PACKAGED ELECTRONICS BASED ON THE PARTIAL-ELEMENT EQUIVALENT-CIRCUIT FORMULATION

Citation
W. Pinello et al., HYBRID ELECTROMAGNETIC MODELING OF NOISE INTERACTIONS IN PACKAGED ELECTRONICS BASED ON THE PARTIAL-ELEMENT EQUIVALENT-CIRCUIT FORMULATION, IEEE transactions on microwave theory and techniques, 45(10), 1997, pp. 1889-1896
Citations number
17
Categorie Soggetti
Engineering, Eletrical & Electronic
ISSN journal
00189480
Volume
45
Issue
10
Year of publication
1997
Part
2
Pages
1889 - 1896
Database
ISI
SICI code
0018-9480(1997)45:10<1889:HEMONI>2.0.ZU;2-3
Abstract
The partial-element equivalent-circuit (PEEC) method is used to develo p a flexible, hierarchical electromagnetic modeling and simulation env ironment for the analysis of noise generation and signal degradation m echanisms in packaged electronic components and systems, The circuit-o riented approach used by the method for the development of the numeric al approximation of the electric-field integral equation leads to SPIC E-compatible, yet fully dynamic, discrete approximation of the electro magnetic problem, Contrary to other full-wave formulations, the propos ed method has the important attribute of lending itself to a very syst ematic and physical model complexity reduction on the basis of the ele ctrical size of the various portions of the system, Thus, a hybrid ele ctromagnetic modeling and simulation environment is established for th e analysis of complex structures which exhibit large variation in elec trical size over their volume, using a combination of lumped-circuit e lements, transmission lines, as well as three-dimensional (3-D) distri buted electromagnetic models, These models may or mag not account for retardation, depending on the electrical size of the part of the struc ture that is being modeled. These special attributes of the proposed e lectromagnetic-simulation environment are demonstrated through several examples from its application to the modeling of noise interactions i n generic interconnect and package geometries.