TIME-DOMAIN CHARACTERIZATION OF PACKAGING EFFECTS VIA SEGMENTATION TECHNIQUE

The analysis of a monolithic microwave integrated circuit (MMIC) place d in a surface-mount plastic package is presented, Critical issues suc h as poor grounding conditions and crosstalk are addressed and discuss ed. The significance of a full-wave characterization of the component is shown. Results are validated with data available in the literature showing good agreement, A segmentation approach is also proposed to ef ficiently analyze the problem, The package effects are extracted and c an be combined with MMIC parameters at the design stage to predict the performance of the packaged circuit.