The behavior of rf plasma sheaths has been the subject of much scienti
fic study and also is technologically important for plasma etching and
deposition in the manufacture of integrated circuits. This paper pres
ents a semianalytic model of rf sheaths and describes an experiment th
at tested the model. An approximation to the first integral of the Poi
sson equation allows solving for the response of plasma sheaths to an
imposed rf bias voltage. This approximation enables the plasma sheaths
to be included within an electrical model of the plasma and external
rf circuit components, and affords a prediction of the ion energy dist
ributions impacting the electrodes, which are in contact with the plas
ma. The model is a significant advance beyond previous sheath models b
ecause it has no restriction on the ratio of the rf period to the ion
transit time across the sheath. The model is applicable to those high-
density, low-pressure plasmas in which the Debye length is a small fra
ction of the ion mean-free path, which itself is a small fraction of t
he plasma dimension. The experimental test of the model was conducted
by comparing the predicted and measured rf potential, current, and pow
er at the sheath adjacent to a capacitively coupled, rf-biased electro
de in a plasma reactor with argon discharges sustained by an inductive
ly coupled plasma source. The comparisons included both linear and non
linear components of the rf electrical parameters. Results of the expe
riment were in substantial agreement with model predictions. (C) 1997
American Institute of Physics.