Two types of Bi-2212 thick films using Bi-2212 superconducting whisker
s have been prepared. One is composite films incorporating the whisker
s (20 wt.%). The composite films have been prepared by an isothermal p
artial melting method. It is found that the incorporation of the whisk
ers is effective for overcoming weak links at grain boundaries. In con
sequence, J(c) for the composite film is about three times higher than
for a film without whiskers (monolithic film). The other is in-plane
aligned Bi-2212 thick films consisting of only whiskers. The in-plane
aligned films have been prepared by hot pressing the a-axis aligned wh
isker preforms. J(c) for the in-plane aligned film is two times higher
than for the in-plane random thick film.