SURFACE-ROUGHNESS AND MATERIAL REMOVAL RATE OF LAPPING PROCESS ON CERAMICS

Authors
Citation
Y. Ahn et Ss. Park, SURFACE-ROUGHNESS AND MATERIAL REMOVAL RATE OF LAPPING PROCESS ON CERAMICS, KSME International Journal, 11(5), 1997, pp. 494-504
Citations number
13
Categorie Soggetti
Engineering, Mechanical
Journal title
KSME International Journal
ISSN journal
12264865 → ACNP
Volume
11
Issue
5
Year of publication
1997
Pages
494 - 504
Database
ISI
SICI code
1011-8861(1997)11:5<494:SAMRRO>2.0.ZU;2-H
Abstract
Lapping is a widely used surface finishing process for ceramics. An ex perimental investigation is conducted into the lapping of alumina, Ni- Zn ferrite and sodium silicate glass using SiC abrasive to study the e ffect of process parameters, such as abrasive particle size, lapping p ressure, and abrasive concentration, on the surface roughness and mate rial removal rate during lapping. A simple model is developed based on the indentation fracture and abrasive particle distribution in the sl urry to explain various aspects of the lapping process. The model prov ides predictions for the surface roughness, R-a and R-t, on the machin ed surface and rough estimation for the material removal rate during l apping. Comparison of the predictions with the experimental measuremen ts reveals same order of magnitude accuracy.