P. Doshi et al., CHARACTERIZATION AND OPTIMIZATION OF ABSORBING PLASMA-ENHANCED CHEMICAL-VAPOR-DEPOSITED ANTIREFLECTION COATINGS FOR SILICON PHOTOVOLTAICS, Applied optics, 36(30), 1997, pp. 7826-7837
We have optimized plasma-enhanced chemical vapor deposition (PECVD) of
SM-based antireflection (AR) coatings with special consideration for
the short-wavelength (<600 nm) parasitic absorption in SiN. Spectrosco
pic ellipsometry was used to measure the dispersion relation for both
the refractive index n and the extinction coefficient k, allowing a pr
ecise analysis of the trade-off between reflection and absorption in S
iN-based AR coatings. Although we focus on photovoltaic applications,
this study may be useful for photodetectors, IR optics, and any device
for which it is essential to maximize the transmission of light into
silicon. We designed and optimized various AR coatings for minimal ave
rage (spectrally) weighted reflectance ([R-w]) and average weighted ab
sorptance ([A(w)]), using the air mass 1.5 global solar spectrum. In m
ost situations [R-w] decreased with higher n, but [A(w)] increased bec
ause k increased with n. For the practical case of a single-layer AR c
oating for silicon under glass, an optimum refractive index of similar
to 2.23 (at 632.8 nm) was determined. Further simulations revealed th
at a double-layer SiN stack with an n = 2.42 film underneath an n = 2.
03 film gives the minimum total photocurrent loss, Similar optimizatio
n of double-layer SiN/SiO2 coatings for silicon in air revealed an opt
imum of n = 2.28 for SiN. To determine the allowable tolerance in inde
x and film thickness, we generated isotransmittance plots, which revea
led more leeway for n values below the optimum than above because abso
rption begins to reduce photocurrent for high n values. (C) 1997 Optic
al Society of America.