SUBSTRATE BONDING TECHNIQUES FOR CMOS PROCESSED WAFERS

Authors
VANDERGROEN S ROSMEULEN M BAERT K JANSEN P DEFERM L
Citation
S. Vandergroen et al., SUBSTRATE BONDING TECHNIQUES FOR CMOS PROCESSED WAFERS, Journal of micromechanics and microengineering, 7(3), 1997, pp. 108-110
Citations number
6
Categorie Soggetti
Engineering, Eletrical & Electronic","Engineering, Mechanical
Journal title
Journal of micromechanics and microengineering → ACNP
ISSN journal
09601317
Volume
7
Issue
3
Year of publication
1997
Pages
108 - 110
Database
ISI
SICI code
0960-1317(1997)7:3<108:SBTFCP>2.0.ZU;2-H
Abstract
Transferring a CMOS circuit to a foreign substrate can be accomplished by bonding a processed silicon wafer to the substrate anti subsequent ly thinning the silicon wafer. This paper presents both anodic bonding and adhesive bonding and evaluates their potential for circuit transf er.