DETERMINATION OF FRACTURE-TOUGHNESS OF THERMALLY CONDUCTIVE ADHESIVES

Authors
JIH E PAO YH SONG X LARNER C
Citation
E. Jih et al., DETERMINATION OF FRACTURE-TOUGHNESS OF THERMALLY CONDUCTIVE ADHESIVES, Journal of electronic packaging, 119(3), 1997, pp. 204-207
Citations number
11
Categorie Soggetti
Engineering, Mechanical","Engineering, Eletrical & Electronic
Journal title
Journal of electronic packaging → ACNP
ISSN journal
10437398
Volume
119
Issue
3
Year of publication
1997
Pages
204 - 207
Database
ISI
SICI code
1043-7398(1997)119:3<204:DOFOTC>2.0.ZU;2-S