Pure rolled, annealed copper and copper-polyimide (Kapton) laminates w
ere tested under constant amplitude cyclic loading to determine the fa
tigue crack growth rate. It was found that the laminated samples could
sustain a much higher load for the same fatigue life, or had a longer
fatigue life for the same load. This result is due to the polyimide b
ridging across cracks in the copper. The reduction of the crack tip st
resses due to bridging is quantified by an analytical approximation an
d by layered finite element analyses. Despite the low elastic modulus
of polyimide relative to copper, the stress reduction is significant d
ue to the high effective stiffness of the bridging layer which results
from the thinness of the adhesive layer between the copper and polyim
ide. When the experimental data from the laminated samples are analyze
d using the results of a layered finite element analysis good correlat
ion is obtained between the crack growth rate in pure copper and in th
e copper-polyimide laminates.