F. Nakagawa et al., 2-DIMENSIONAL THERMAL-STRESS ANALYSIS OF BUTT ADHESIVE JOINT CONTAINING RIGID FILLERS IN THE ADHESIVE, JSME international journal. Series A, mechanics and material engineering, 37(3), 1994, pp. 238-245
Thermal stress distribution and thermal strength were examined when bu
tt adhesive joints with rigid fillers in the adhesive were in steady-s
tate temperature distribution. In the analyses, thermal stress distrib
ution in the adhesive was obtained using the two-dimensional theory of
elasticity in the case where adherends of the same size and rigid mat
erial were kept at a constant temperature and the side surfaces of the
joint were surrounded with fluid of a different constant temperature.
Numerical calculations showed that thermal stress was tensile near th
e edges of the interface between the adherend and the adhesive layer,
that around the interface area underneath which the filler was located
, the thermal stress was concentrated at the periphery of the filler,
and that a large amount of thermal stress was generated when the fille
r size was large. Photoelastic experiments were carried out, and the a
nalytical results were shown to be consistent with the experimental on
es.