EFFECTS OF THE COOLING RATE ON THE MECHANICAL AND ELECTRICAL BEHAVIOROF A 63SN 37PB SOLDER BUMP ON A METALLIZED SI SUBSTRATE/

Authors
CHIOU BS CHENG JC
Citation
Bs. Chiou et Jc. Cheng, EFFECTS OF THE COOLING RATE ON THE MECHANICAL AND ELECTRICAL BEHAVIOROF A 63SN 37PB SOLDER BUMP ON A METALLIZED SI SUBSTRATE/, Journal of materials science. Materials in electronics, 5(4), 1994, pp. 229-234
Citations number
12
Categorie Soggetti
Engineering, Eletrical & Electronic","Physics, Condensed Matter","Material Science
Journal title
Journal of materials science. Materials in electronics → ACNP
ISSN journal
09574522
Volume
5
Issue
4
Year of publication
1994
Pages
229 - 234
Database
ISI
SICI code
0957-4522(1994)5:4<229:EOTCRO>2.0.ZU;2-N
Abstract
Flip-chip bonding technology, with solder bumps deposited on metal ter minals on the chip, provides the highest functional densities of all t he present bonding techniques. In this study, tin-lead solder bumps we re screen printed onto a metallized Si substrate. Various cooling rate s were employed after reflowing the solder bumps. The effect of the co oling rate on the microhardness, the adhesion strength and the electri cal resistance of solder joints was studied and the mechanism explored . It was found that intermetallic compounds play important roles in bo th the mechanical and the electrical behaviour of the solder bumps.