We have designed and fabricated a novel lateral field emitter triode,
which is in situ vacuum encapsulated so that any troublesome additiona
l vacuum sealing process is not required, The device exhibits low turn
-on voltage of 7 V, stable current density of 2 mu A per tip, and high
transconductance of 1.7 mu S per 100 tips field emitter array at V-AC
= 22 V, An in situ vacuum encapsulation employing recessed cavities b
y isotropic RIE (reactive ion etch) method and an electron beam evapor
ated molybdenum vacuum seal are implemented to fabricate the new field
emitter triode, The superb field emitter characteristics are probably
due to sub-micron dimension device structure and the pencil type late
ral cathode tip employing upper and lower LOCOS oxidation.