An enhancement mode diamond FET using a hydrogen-terminated surface as
hole conductive channel has been fabricated with 200 V gate to drain
breakdown voltage, At the 8.5-mu m gate length the maximum drain curre
nt was 22 mA/mm. 90 mA/mm maximum drain current was obtained at a gate
length of 3.0 mu m. Scaling to below 1 mu m gate length assuming unde
graded breakdown conditions will result in a projected RF power handli
ng capability above 6 W/mm.