LARGE-SIZE OF REAL-TIME BI12SIO20 HOLOGRAM DEVICE MADE WITH INEXPENSIVE WAFER CUTTING METHOD

The large real-time hologram device made by the previous Bi12SiO20 sin gle crystal wafer cutting method poses several problems such as a larg e residue of material hinders the practical use. A study was carried o ut to fabricate a real-time hologram device using inexpensive laterall y cut circular (1 0 0) Bi12SiO20 Single crystal wafers which would be suitable for practical use for 3-dimensional display. An angle inciden t on a (1 0 0) wafer is applicable to the real-time hologram. An optim al electrode design for a device with uniform diffraction efficiency w as considered, and the device properties were experimentally investiga ted.