In this work the properties of polycrystalline silicon layers obtained
by rapid thermal annealing have been discussed. Amorphous silicon lay
ers with thickness of 3000 Angstrom have been deposited on silicon waf
ers in rf sputtering system. The layers were annealed for 15 s to 5 mi
n at temperatures in the range 800-1200 degrees C in vacuum 5 x 10(-5)
Torr. A correlation was established between structure, morphology, sh
eet resistance, and the parameters of the RTA annealing.