INFLUENCE OF STRAIN PATH ON TEXTURE AND MICROSTRUCTURAL DEVELOPMENT IN POLYCRYSTALLINE CU AND CU-5 WT PERCENT AL-ALLOY

Polycrystalline Cu and Cu-5 wt % Al alloy were rolled to 50 % reductio n and compressed additionally 30 % in a channel die, For part of the c ompressed material, the direction of plastic flow was parallel to the transverse direction of former rolling. For the rest of the material, the direction of plastic flow was the same as during rolling. Examinat ions of the texture and microstructure after deformation and recrystal lization were performed, For copper, the changes in deformation path a lters the crystallographic texture while the microstructure remains re latively homogeneous. In contrast, changes in deformation path applied to the alloy reveal that the structure rather than the texture is sig nificantly altered. In the alloy, the great number of shear bands cros sing several grains was the predominant feature of the microstructure. The kinetic of recrystallization depends on the changes of the direct ion of plastic flow during secondary deformation only for the CuAl all oy. In this case, recrystallization proceeds first in shear bands resu lting in nonuniform grain size after recrystallization.