Sh. Kim et Nk. Anand, TURBULENT HEAT-TRANSFER BETWEEN A SERIES OF PARALLEL PLATES WITH SURFACE-MOUNTED DISCRETE HEAT-SOURCES, Journal of heat transfer, 116(3), 1994, pp. 577-587
Two-dimensional turbulent heat transfer between a series of parallel p
lates with surface mounted discrete block heat sources was studied num
erically. The computational domain was subjected to periodic condition
s in the streamwise direction and repeated conditions in the cross-str
eam direction (Double Cyclic). The second source term was included in
the energy equation to facilitate the correct prediction of a periodic
ally fully developed temperature field. These channels resemble coolin
g passages in electronic equipment. The k-epsilon model was used for t
urbulent closure and calculations were made for a wide range of indepe
ndent parameters (Re, K(s)/K(f), s/w, d/w, and h/w). The governing equ
ations were solved by using a finite volume technique. The numerical p
rocedure and implementation of the k-epsilon model was validated by co
mparing numerical predictions with published experimental data (Wirtz
and Chen, 1991; Sparrow et al., 1982) for a single channel with severa
l surface mounted blocks. Computations were performed for a wide range
of Reynolds numbers (5 x 10(-4) x 10(5)) and geometric parameters and
for Pr = 0.7. Substrate conduction was found to reduce the block temp
erature by redistributing the heat flux and to reduce the overall ther
mal resistance of the module. It was also found that the increase in t
he Reynolds number decreased the thermal resistance. The study showed
that the substrate conduction can be an important parameter in the des
ign and analysis of cooling channels of electronic equipment. Finally,
correlations for the friction factor (f) and average thermal resistan
ce (R) in terms of independent parameters were developed.