WAFER BONDING TECHNOLOGY AND ITS APPLICATIONS IN OPTOELECTRONIC DEVICES AND MATERIALS

Direct wafer bonding process has found broad applications in many crit ical areas including both commercial and state-of-the-art photonic dev ices and more recently, formation of semiconductor compliant substrate s. Using the wafer bonding technology, we have demonstrated 1.3-mu m v ertical-cavity surface-emitting lasers (VCSEL's) with a 1-mA continuou s-wave (CW) threshold current and 0.83-mA pulsed threshold current. Su perior device performance has also been achieved,vith photodetectors a nd micromachined tunable devices. Applying the wafer bonding process i n a novel way, we have fabricated compliant universal substrates on wh ich largely mismatched (e.g., 15% mismatch) heteroepitaxial layers can be grown defect free.