PREPARATION OF SRBI2TA2O9 FILM AT LOW-TEMPERATURES AND FABRICATION OFA METAL FERROELECTRIC/INSULATOR/SEMICONDUCTOR FIELD-EFFECT TRANSISTORUSING AL/SRBI2TA2O9/CEO2/SI(100) STRUCTURES/
T. Hirai et al., PREPARATION OF SRBI2TA2O9 FILM AT LOW-TEMPERATURES AND FABRICATION OFA METAL FERROELECTRIC/INSULATOR/SEMICONDUCTOR FIELD-EFFECT TRANSISTORUSING AL/SRBI2TA2O9/CEO2/SI(100) STRUCTURES/, JPN J A P 1, 36(9B), 1997, pp. 5908-5911
We report on the fabrication of an n-channel metal/ferroelectric/insul
ator/semiconductor (MFIS)-Field Effect Transistor (FET) using Al/SrBi2
Ta2O9/CeO2/Si(100) structures and its characterization, as well as on
the preparation of SrBi2Ta2O9 ferroelectric films at low temperatures.
SrBi2Ta2O9 ferroelectric films fabricated at about 650 degrees C on a
Pt/SiO2/Si substrate had a remanent polarization (P-r) of 7.8 mu C/cm
(2). The drain current-gate voltage (I-D-V-G) characteristics of MFIS-
FET using the Al/SrBi2Ta2O9/CeO2/Si(100) structure showed threshold hy
steresis due to the ferroelectric properties of the SrBi2Ta2O9 film. N
onvolatile memory operations of the MFIS-FET were demonstrated by obse
rving its drain current (I-D) which was controlled by previously appli
ed write voltages.