Polycrystalline silicon films have been prepared by hot wire chemical
vapor deposition (HWCVD) at a relatively low substrate temperature of
430 degrees C at a high growth rate (> 5 Angstrom/s) by optimizing the
hydrogen dilution of the silane feedstock gas, the gas pressure and t
he wire temperature. The optimized material has 95% crystalline volume
fraction with complete coalescence of grains. The grains with an aver
age size of 70 nm have a preferential orientation along the (220) dire
ction. Large structures up to 0.5 mu m could be observed by atomic for
ce microscopy (AFM). An activation energy of 0.54 eV for the electrica
l transport and a low carrier concentration (< 10(11)cm(-3)) confirmed
the intrinsic nature of the films. A white light photoconductivity of
1.9 x 10(-5)Ohm(-1)cm(-1), a high minority carrier diffusion length o
f 334 nm and a low (< 10(17)cm(-3)) defect density ensure that the pol
y-Si:H films possess device quality. A very small temperature dependen
ce of the Hall mobility (0.012 eV) indicates negligible barrier to car
rier transport at the grain boundaries. A single junction n-i-p cell i
ncorporating HWCVD polySi:H in the configuration n(+)-c-Si/i-poly-Si:H
/p-mu c-Si:H/ITO yielded 3.15% efficiency under 100 mW/cm(2) AM1.5 ill
umination and a current density of 18.2 mA/cm(2) was achieved for only
1.5 mu m thick i-layer.