Metal/ferroelectric/insulator/semiconductor (MFIS) capacitors were pre
pared by depositing PbTiO3 and TiO2 layers on Si(100) wafers at 450 an
d 550 degrees C using metal organic chemical vapor deposition (MOCVD).
The C-V properties of the capacitors depend on the quality of TiO2 fi
lms and TiO2/Si interfaces. The TiO2 film could serve as an effective
buffer layer against the Pb diffusion and provide good C-V properties
as long as it was deposited at proper substrate temperature with prope
r thickness.