A SiNx:H/SiO2 double-layer structure as the passivation layer and hydr
ogen-radical post annealing were introduced to decrease the surface re
combination velocity on crystalline silicon. Effective lifetime was mu
ch increased by introducing a SiNx:H/SiO2 double-layer passivation str
ucture instead of a SiNx:H or SiO2 single-layer, while the hydrogen ra
dical post annealing improves the interface characteristics more effec
tively than N-2 annealing. The results of C-V measurement suggest that
many positive charges exist in the SiNx:H layer. The combination of f
ield effect by these charges and the decrease of SiO2/c-Si interface d
efects by hydrogen-radical annealing effectively decrease the surface
recombination velocity.