X. Colom et al., OPTIMIZATION OF THE STAGE OF ETCHING IN T HE PROCESS OF COPPER ELECTRODEPOSITION ON PIECES OF ABS (ACRYLONITRILE-BUTADIENE-STYRENE), Afinidad, 54(471), 1997, pp. 377-381
This paper describes how the stage of etching has been optimitzed as e
ssential stage of the electrodeposition process of Cu on pieces of ABS
. Acids oxidiziers (nitric acid, sulphuric acid, perchloric acid and c
hromic acid) have been used and the pieces of ABS have been submitted
to different concentrations, temperatures, periods of exposition and t
o the presence of a surface active agent that reduces the superficial
tension of the bath and improves the impregnabilitie. In all cases, it
has been seen that concentration and temperature improve the yield, a
lthough in some cases they provoke a deterioration of the mechanical p
roperties. In most cases the optimum treatment time is 12 minutes. The
presence of a surface active agent always improves the yield.