M. Borgarino et al., ELECTRICAL AND THERMAL SIMULATION OF LOCAL-EFFECTS FOR ELECTROMIGRATION, Semiconductor science and technology, 12(11), 1997, pp. 1369-1377
The aim of this work is to investigate the distribution of the local c
urrent density and temperature gradients along the test patterns emplo
yed for the evaluation of the electromigration phenomena in metal trac
ks. The impact of the line shape is taken into account. The investigat
ion has been performed by means of a 2D simulator based on a FEM solve
r.