Mk. Gobbert et al., A MULTISCALE SIMULATOR FOR LOW-PRESSURE CHEMICAL-VAPOR-DEPOSITION, Journal of the Electrochemical Society, 144(11), 1997, pp. 3945-3951
An integrated simulator for chemical vapor deposition is introduced. I
n addition to reactor scale and feature scale simulators, it includes
a ''mesoscopic'' scale simulator with the typical length scale of a di
e. It is shown that the ''three-scale'' integrated simulator used is a
proper extension of ''two-scale'' deposition simulators that consist
of reactor scale and feature scale simulation models. Moreover, it is
demonstrated that information is provided on a new length scale, for w
hich no information is available from the ''two-scale'' approach, as w
ell as important corrections to the simulation results on the reactor
scale. This enables, for instance, studies of microloading. Thermally
induced deposition of silicon dioxide from tetraethyoxysilane is chose
n as the application example. The deposition chemistry is modeled usin
g six gaseous reacting species involved in four gas-phase and eight su
rface reactions.