Ceramic materials are finished primarily by abrasive machining process
es such as grinding, lapping, and polishing. In grinding, the abrasive
s typically are bonded in a grinding wheel and brought into contact wi
th the ceramic surface at relatively high sliding speeds. In lapping a
nd polishing, the ceramic is pressed against a polishing block with th
e abrasives suspended in between them in the form of a slurry. The mat
erial removal process here resembles three-body wear. In all these pro
cesses, the mechanical action of the abrasive-can be thought of as the
repeated application of relatively sharp sliding indenters to the cer
amic surface. Under these conditions, a small number of mechanisms dom
inate the material removal process. These are brittle fracture due to
crack systems oriented both parallel (lateral) and perpendicular (radi
al/median) to the free surface, ductile cutting with the formation of
thin ribbon-like chips, and chemically assisted wear in the presence o
f a reactant that is enhanced by the mechanical action (tribochemical
reaction). The relative role of each of these mechanisms in a particul
ar finishing process can be related to the load applied to an abrasive
particle, the sliding speed of the particle, and the presence of a ch
emical reactant. These wear mechanisms also cause damage to the near c
eramic surface in the form of microcracking, residual stress, plastic
deformation, and surface roughness which together determine the streng
th and performance of the finished component. A complete understanding
of the wear mechanisms leading to material removal would allow for th
e design of efficient machining processes for producing ceramic surfac
es of high quality.