FOUNDARY FABRICATED ARRAY OF SMART PIXELS INTEGRATING MESFETS MSMS AND VCSELS/

We have developed a process for the integration of vertical cavity sur face emitting lasers (VCSELs) with foundry fabricated integrated circu its using a co-planar flip-chip bump-bonding process. Metal-semiconduc tor-metal (MSMs) photodetectors are fabricated directly onto the integ rated circuit through the Vitesse 1.0 mu m E/D MESFET process along wi th the logic and VCSEL drivers. This technique can be used for the fab rication of OEICs by integrating VCSELs and photodetectors into an arr ay of smart pixels, allowing much faster throughput than wire-bonding hybrid approaches.