SURFACE MODIFICATION BY PLASMA-ETCHING AND PLASMA PATTERNING

Citation
Lm. Dai et al., SURFACE MODIFICATION BY PLASMA-ETCHING AND PLASMA PATTERNING, JOURNAL OF PHYSICAL CHEMISTRY B, 101(46), 1997, pp. 9548-9554
Citations number
66
Categorie Soggetti
Chemistry Physical
Journal title
JOURNAL OF PHYSICAL CHEMISTRY B
ISSN journal
15206106 → ACNP
Volume
101
Issue
46
Year of publication
1997
Pages
9548 - 9554
Database
ISI
SICI code
1089-5647(1997)101:46<9548:SMBPAP>2.0.ZU;2-1
Abstract
Using radio-frequency glow-discharge plasma techniques, we have prepar ed surface patterns of various chemical functionalities on a micromete r scale. While H2O-plasma etching, discovered in this study, was used for generating surface patterns of oxygen-containing polar groups usin g a mask, surface patterning of various functionalities, including bot h polar and nonpolar groups, was achieved by plasma polymerization in a patterned fashion using appropriate monomer vapors and/or discharge conditions. Furthermore, we have developed a versatile method for obta ining patterned conducting polymers by first depositing a thin, patter ned plasma polymer layer using a mask onto a metal-sputtered electrode and then performing electropolymerization of monomers such as pyrrole within the regions not covered by the patterned plasma polymer layer. The conducting polymer patterns thus prepared were shown to be electr ically active.