It is demonstrated that deep states in silicon on sapphire (SOS) films
can be evaluated by transient-current spectroscopy (TCS). In the TCS
spectra, a broad peak extending over 100-200 K was observed for the 60
00-Angstrom-thick n-type SOS film. Assuming the value of capture cross
section to be 10(-15) cm(2) and independent of temperature, the densi
ty distribution of deep states was estimated. The density distribution
shows a peak of 1.2 x 10(12) cm(-2) eV(-1) at E-C-0.25 eV. Raman back
scattering spectroscopy was also performed to evaluate the stress in t
he silicon film, It was concluded that the defects detected by TCS sho
uld be caused by the compressive stress of 6.2 x 10(8) Pa in the silic
on film. (C) 1997 American Institute of Physics.