A kinetic model of time-dependent dielectric breakdown for polymers is
presented. The micromechanism of thermally activated bond-breakdown i
s developed for polymers to account for the dynamical process of diele
ctric breakdown. We first prove that the thermally activated polymer b
ond-breakdown processes can explain not only the burst of a conducting
pathway nucleated in any defect and the following successive propagat
ion, but also the time-dependent dielectric breakdown strength of poly
mers. The formulae for conducting microcrack growth rate and time to f
ailure are derived and applied to the experimental data for polyethyle
ne terephthalate films.