St. Kim et al., POLYMERIZATION OF N-(TERT-BUTYLDIMETHYLSILYLOXY)MALEIMIDE AND APPLICATIONS OF THE POLYMERS AS RESIST MATERIALS, Journal of applied polymer science, 66(13), 1997, pp. 2507-2516
A new silicon-containing maleimide monomer, N-(tert-butyldimethylsilyl
oxy) maleimide (SiOMI) has been synthesized. SiOMI was radically copol
ymerized with styrene derivatives (XSt) to obtain alternating copolyme
rs, P(SiOMI/XSt), in high conversions. The copolymers have high glass
transition temperatures above 190 degrees C, and the tert-butyldimethy
lsilyloxy groups are thermally stable up to 300 degrees C. The SiOMI u
nits in the copolymers were converted into N-hydroxymaleimide (HOMI) u
nits by acidolytic deprotection of the tert-butyldimethylsilyloxy prot
ecting groups. The facile deprotection of the side-chain tert-butyldim
ethylsilyloxy groups from the protected copolymers provided a signific
ant change in solubility of the polymers due to the large polarity cha
nge. Submicron positive-tone images were obtained from the copolymers
containing an onium salt as a photoacid generator by irradiation with
electron beam and development with alkaline solutions. The polymer fil
ms also showed very high oxygen plasma etch resistance compared with n
ovolac resins. The silicon-containing maleimide polymers were found to
have required properties, such as good alkaline solubility after depr
otection, superior adhesion, low optical density, high thermal stabili
ty with high T-g, and high plasma etch resistance for applications as
deep ultraviolet and electron beam resist materials. (C) 1997 John Wil
ey & Sons, Inc.