A NOVEL MICROMACHINING TECHNIQUE FOR THE FORMATION OF EXTRUSIONS

A novel micro-extrusion process (MEP)has been developed for micromachi ning applications, Extrusions on the micrometer scale were realized us ing the compressive stresses resulting from electromigration-induced m ass transport in planarized conductors, Electromigration produced comp ressive stresses at the anodes of passivated metallic interconnects th at exceeded the plastic deformation stress, and allowed extrusions to form through simple die patterns etched through the passivation at the anode ends of edge-displacement conductor segments.