STABILIZATION OF COPPER(III) COMPLEXES BY DISUBSTITUTED OXAMIDES AND RELATED LIGANDS

Citation
R. Ruiz et al., STABILIZATION OF COPPER(III) COMPLEXES BY DISUBSTITUTED OXAMIDES AND RELATED LIGANDS, Journal of the Chemical Society. Dalton transactions, (5), 1997, pp. 745-751
Citations number
32
Categorie Soggetti
Chemistry Inorganic & Nuclear
ISSN journal
03009246
Issue
5
Year of publication
1997
Pages
745 - 751
Database
ISI
SICI code
0300-9246(1997):5<745:SOCCBD>2.0.ZU;2-K
Abstract
The electrochemical behaviour of a family of monomeric copper(II) comp lexes of the related tetraanionic chelating ligands N,N'-o-phenylenebi s(oxamate) (L(1)) and its methylamide (L(2)) and bis(methylamide) (LS) has been investigated by cyclic voltammetry in acetonitrile at 25 deg rees C and 0.1 mol dm(-3) NEt(4)ClO(4) as supporting electrolyte. The copper(III)-copper(II) reduction potentials have been found to span a potential range from +0.41 to -0.02 V (vs. saturated calomel electrode ), being reversible for all cases except the copper(II)-L(1) complex. The trend in formal potentials along this series is explained in terms of the stronger donor properties of the deprotonated-amido nitrogen a toms than those of the carboxylate oxygen ones. Hence, the stabilizati on of the trivalent oxidation state of copper is attributed to the inc reasing number of deprotonated-amido donor groups. A perfect correlati on has been observed within this family between the Cu-III-Cu-II poten tials and the visible absorption maxima of the copper(II) complexes. T he relative gain in crystal-field stabilization energy for the change from the d(9) (Cu-II, square planar) to the low-spin d(8) (Cu-III, squ are-planar) electronic configuration is the main factor in the overall thermodynamic stability of the copper((III)) complexes. The molecular structure of the stable copper(III) complex [PPh(4)l[CuL(3)]. MeCN ha s been determined by single-crystal X-ray analysis. The metal is in a nearly square-planar environment formed by the four amido nitrogen ato ms of the chelating ligand, with short Cu-N bond distances (1.84-1.88 Angstrom) typical of trivalent copper.