MODELING OF PIEZOELECTRIC CERAMIC VIBRATORS INCLUDING THERMAL EFFECTS.3. BOND GRAPH MODEL FOR ONE-DIMENSIONAL HEAT-CONDUCTION

Citation
Wk. Moon et Ij. Buschvishniac, MODELING OF PIEZOELECTRIC CERAMIC VIBRATORS INCLUDING THERMAL EFFECTS.3. BOND GRAPH MODEL FOR ONE-DIMENSIONAL HEAT-CONDUCTION, The Journal of the Acoustical Society of America, 101(3), 1997, pp. 1398-1407
Citations number
24
Categorie Soggetti
Acoustics
ISSN journal
00014966
Volume
101
Issue
3
Year of publication
1997
Pages
1398 - 1407
Database
ISI
SICI code
0001-4966(1997)101:3<1398:MOPCVI>2.0.ZU;2-T
Abstract
A new bond graph model for conduction heat transfer is developed, and applied to thermal energy balance in the piezoelectric thickness vibra tor. In formulation of the heat conduction model, the mechanical and e lectrical effects are included. Hence, it can be directly applied to t he temperature-dependent thickness vibrator. For the purpose of evalua tion of the new method, one-dimensional heat conduction excluding othe r variable effects is compared with the results of the analytic soluti ons in simple cases. The simulation illustrates the validity and the a ccuracy of the model. Although the model is applied to the one-dimensi onal case only, the method can be easily used for general heat conduct ion problems. (C) 1997 Acoustical Society of America.