Atomic layer etching of Ge has been investigated experimentally based
on the surface chemistry that Cl can adsorb on the clean Ge surface at
room temperature and desorb thermally as GeCl2 at high temperatures.
The ideal etching rate of one monolayer per cycle has been achieved. T
he critical Cl-2 dosage for the saturated etching rate was about 7.2 X
10(6) L. Increase of the surface roughness after etching of 100 cycle
s was about 3.5 monolayers.