Fluid flow and fluid evaporation both contribute to the overall rate o
f thinning during spinning of a fluid on a disk. Laser interferometry
of solvent thinning behavior on spinning silicon wafers was performed
to yield plots of solvent thickness evolution. These plots of thicknes
s versus time were then analyzed to understand the respective contribu
tions of viscous flow and evaporation to the thinning. A technique is
described for extracting both the viscosity and the evaporation rate f
rom the interference data. Well understood solvent systems are examine
d as test cases for this deconvolution. It is also demonstrated that n
onevaporating fluids can be analyzed, even though their thickness evol
ution has no easily referenced endpoint to the thinning, in contrast t
o the volatile solvents which are rapidly spun dry. (C) 1997 American
Institute of Physics.