THIN-FILM PROPERTIES OF TUNGSTEN NUCLEATION LAYER IN BLANKET TUNGSTENDEPOSITION

Citation
Ri. Hegde et al., THIN-FILM PROPERTIES OF TUNGSTEN NUCLEATION LAYER IN BLANKET TUNGSTENDEPOSITION, Journal of the Electrochemical Society, 144(3), 1997, pp. 1087-1090
Citations number
15
Categorie Soggetti
Electrochemistry
ISSN journal
00134651
Volume
144
Issue
3
Year of publication
1997
Pages
1087 - 1090
Database
ISI
SICI code
0013-4651(1997)144:3<1087:TPOTNL>2.0.ZU;2-3
Abstract
Thin film properties of tungsten nucleation layers were investigated a s a function of SiH4:WF5 flow ratio by Auger electron spectroscopy (AE S) depth profiling, thin film x-ray diffraction (XRD), atomic force mi croscopy (AFM), secondary ion mass spectrometry (SIMS), and resistivit y measurements. Tungsten nucleation layers, approximately 1000 Angstro m thick, were deposited on the TiN/Ti glue layer stack at 3:1 and 6:1 SiH4:WF5 flow ratio. The 6:1 flow ratio film gave different film prope rties compared to the 3:1 film. The AES and XRD results showed that th e 6:1 film consists primarily of WSi2, whereas the 3:1 film contains a mixture of W5Si3, WSi2, and possibly W. The AFM analysis indicated th at the 6:1 nucleation layer is far smoother and less porous than the 3 :1 film, indicating that it is a better diffusion barrier to WF6. The 6:1 films had smaller grains of 100 to 120 nm dimension with uniform d istribution. However, the 3:1 films had larger grains of 150 to 190 nm with a bimodal distribution. The 6:1 nucleation is a more robust proc ess to WF6 penetration a conclusion that is further supported by the S IMS data.