Ri. Hegde et al., THIN-FILM PROPERTIES OF TUNGSTEN NUCLEATION LAYER IN BLANKET TUNGSTENDEPOSITION, Journal of the Electrochemical Society, 144(3), 1997, pp. 1087-1090
Thin film properties of tungsten nucleation layers were investigated a
s a function of SiH4:WF5 flow ratio by Auger electron spectroscopy (AE
S) depth profiling, thin film x-ray diffraction (XRD), atomic force mi
croscopy (AFM), secondary ion mass spectrometry (SIMS), and resistivit
y measurements. Tungsten nucleation layers, approximately 1000 Angstro
m thick, were deposited on the TiN/Ti glue layer stack at 3:1 and 6:1
SiH4:WF5 flow ratio. The 6:1 flow ratio film gave different film prope
rties compared to the 3:1 film. The AES and XRD results showed that th
e 6:1 film consists primarily of WSi2, whereas the 3:1 film contains a
mixture of W5Si3, WSi2, and possibly W. The AFM analysis indicated th
at the 6:1 nucleation layer is far smoother and less porous than the 3
:1 film, indicating that it is a better diffusion barrier to WF6. The
6:1 films had smaller grains of 100 to 120 nm dimension with uniform d
istribution. However, the 3:1 films had larger grains of 150 to 190 nm
with a bimodal distribution. The 6:1 nucleation is a more robust proc
ess to WF6 penetration a conclusion that is further supported by the S
IMS data.