The silicon/silicon-dioxide system provides the cornerstone of integra
ted-circuit technology(1). Since the introduction of devices based on
this system, the (largely deleterious) effects on device operation of
mobile and trapped charges in the oxide layer have been studied in gre
at detail, Contamination by alkali ions, for example, was a major conc
ern in the early days of metal-oxide-semiconductor device fabrication(
2), But not all SiO2 impurities are undesirable: the addition of hydro
gen, for example, has the beneficial property of rendering charge trap
s inactive(1), Here we show that mobile H+ ions introduced by annealin
g into the buried oxide layer of Si/SiO2/Si structures, rather than be
ing detrimental, can form the basis of a non-volatile memory device, T
hese mobile protons are confined to the oxide layer, and their space-c
harge distribution can be controlled and rapidly rearranged at room te
mperature by an applied electric held. Memory devices based on this ef
fect are expected to be competitive with current state-of-the-art Si-b
ased memories, with the additional advantage of simplicity-only a few
standard processing steps are required.