Nk. Kim et al., ELECTRICAL AND STRUCTURAL-PROPERTIES OF SRTIO3 THIN-FILMS DEPOSITED BY PLASMA-ENHANCED METALORGANIC CHEMICAL-VAPOR-DEPOSITION, Journal of materials research, 12(4), 1997, pp. 1160-1164
The microstructure and electrical properties were investigated for SrT
iO3(STO) thin films deposited on Pt/Ti/SiO2/Si substrates by PEMOCVD.
The SrF2 phase existing in the STO films deposited at 450 degrees C in
fluences the dielectric constant, dissipation factor, and leakage curr
ent density of STO films, The dielectric constant and dissipation fact
or of STO films deposited at 500 degrees C were 210 and 0.018 at 100 k
Hz, respectively, STO films were found to have paraelectric properties
from the capacitance-voltage characteristics. Leakage current density
of STO films at 500 degrees C was about 1.0 x 10(-8) A/cm(2) at an el
ectric field of 70 kV/cm. The leakage current behaviors of STO films d
eposited at 500 and 550 degrees C were controlled by Schottky emission
with applied electric field.