J. Darnauer et al., A SILICON-ON-SILICON FIELD-PROGRAMMABLE MULTICHIP-MODULE (FPMCM) - INTEGRATING FPGA AND MCM TECHNOLOGIES, IEEE transactions on components, packaging, and manufacturing technology. Part B, Advanced packaging, 18(4), 1995, pp. 601-608
Multichip module technology can dramatically increase the capability o
f held programmable logic devices (FPLD's) and held programmable syste
ms (FPS). We present the special advantages that MCM's offer FPLD's an
d the design of our first-generation field programmable multichip modu
le (FPMCM). Our prototype is the first silicon-on-silicon FPMCM and ha
s a maximum capacity of 40 K gates and 256 user IO, achieving a factor
of four increase in capacity over the FPLD family with which it was d
esigned. Our FPMCM has been demonstrated in a system that can deliver
200 MOP's of computing power for image processing applications. FPMCM'
s can cost-effectively deliver 4-8 times the capacity of the largest F
PLD's and provide even larger reductions in the area of PCB-based fiel
d programmable systems. The upper capacity limits for FPMCM are determ
ined mainly by the cost and defect density of the substrate technology
, As CMOS processed move into the deep-submicron range, FPMCM's will e
ven faster and denser substrates.